company blog about Supply Renesas Wireless Connectivity Evaluation Boards: BLE, NFC, Sub-GHz, Wi-Fi MCUs

Supply Renesas Wireless Connectivity Evaluation Boards: BLE, NFC, Sub-GHz, Wi-Fi MCUs

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(I) BLE Low-Power Bluetooth Evaluation Board: Focused on Low-Power Short-Range Communication

Renesas' BLE evaluation boards prioritise low power consumption and high reliability, catering to various battery-powered portable devices. They cover mainstream Bluetooth versions from 5.1 to 5.3. Core representative models include US159-DA14535EVZ and EK-RA4W1, with corresponding MCUs spanning the DA14535, RA4W1, and RL78/G1D series to meet diverse performance and cost requirements.

1. Core Hardware Configuration

- MCU Core: The US159-DA14535EVZ incorporates the DA14535 SmartBond TINY™ module, utilising the world's smallest and lowest-power Bluetooth 5.3 System-on-Chip (SoC). It features an embedded Arm® Cortex®-M0+ core operating at 16MHz, with 64KB RAM, 12KB OTP, and 160KB ROM. EK-RA4W1 incorporates the RA4W1 32-bit MCU with an integrated Bluetooth 5.0 LE core, offering extensive peripheral functionality and high security.

- RF Performance: Receive sensitivity as low as -92.5dBm (DA14535), maximum output power +4dBm, supports BLE broadcast extension and long-range communication modes, enabling stable communication within 100 metres (open environment). Selected models integrate chip antennas, eliminating the need for additional RF matching circuit design and simplifying hardware layout.

- Expansion and Debugging: Equipped with standard Pmod™ interface (US159-DA14535EVZ), Arduino® UNO interface, and debugging port for rapid expansion of sensors, displays, and other peripherals. On-board momentary pushbutton switch and LED facilitate software debugging. Integrated on-board debugger eliminates the need for additional debugging tools, reducing development costs.

- Power consumption optimisation: At VBAT=3V, reception current is merely 2.7mA, transmission current (0dBm) is 2.6mA. Supports deep sleep mode with sleep current as low as nA-level, suitable for battery-powered portable devices to extend operational endurance. Certain evaluation boards integrate power consumption measurement circuits for precise monitoring of power performance across different operating modes.

2. Software Support

Supports Renesas' FSP software package, integrating a complete BLE 5.3/5.0 protocol stack. Provides 56 standard Bluetooth profiles/services while enabling custom profile generation. Offers extensive sample code covering common scenarios such as Bluetooth serial communication, sensor data transmission, and device pairing, allowing developers to reuse code for rapid feature implementation. Compatible with mainstream IDEs such as IAR and Keil, it supports the graphical configuration tool QE for BLE, simplifying protocol stack configuration workflows.

3. Typical Application Scenarios

Low-power, short-range communication scenarios including:

Portable medical devices (blood pressure monitors, glucose meters)

Smart wearables (bracelets, watches)

Smart home control terminals (lighting, curtain controllers)

Industrial sensor nodes (temperature/humidity sensors, pressure sensors)

Beacon devices (indoor navigation, asset tracking)

(II) NFC Near Field Communication Evaluation Board: Focused on Proximity Identification and Data Exchange

Renesas' NFC evaluation board focuses on short-range identification and data transmission within 10cm. It supports three modes: NFC reader/writer, card emulation, and peer-to-peer communication. Compatible with mainstream NFC standards including ISO 14443 A/B, ISO 18092, and ISO 15693, its core representative model is PTX105REK. Corresponding MCUs/ICs include PTX105R, among others, catering to diverse contactless interaction scenarios.

1. Core Hardware Configuration

- NFC Core: PTX105REK incorporates the PTX105R NFC reader/writer IC, employing a unique sine wave architecture. Compared to traditional square wave NFC controllers, this significantly reduces the bill of materials, simplifies FCC certification processes, and enhances interoperability. It supports medium-power (1W) output, delivering exceptional reception sensitivity and digital waveform shaping capabilities.

- Communication Features: Supports NFC P2P (peer-to-peer) communication and Card Emulation (HCE) mode, enabling rapid data exchange between smartphones and evaluation boards, or between evaluation boards themselves. Integrates Digital Dynamic Power Control (DDPC), Dirac® EMI-free filter solutions, and a High Dynamic Range Receiver (VHDRR) to ensure communication stability in complex environments.

- Expansion and Debugging: Seamlessly integrates with host MCU architectures of various terminals/devices. Equipped with standard interfaces for rapid connection to other Renesas evaluation boards (e.g., RL78, RA series). On-board debug interface supports real-time monitoring of communication data and RF performance, facilitating functional debugging and optimisation.

2. Software Support

Provides a complete NFC protocol stack and software development tools supporting all mainstream NFC protocols and tag types. Developers can rapidly configure NFC read/write, card emulation, and other functions. Includes sample code for scenarios such as NFC tag read/write, mobile NFC pairing, and data transmission, supporting custom data interaction logic. Compatible with Renesas' FSP software package for collaborative development with other wireless protocols like BLE and Wi-Fi, enabling multi-protocol convergence applications.

3. Typical Application Scenarios

Near-field interaction scenarios including contactless payment terminals, access control and attendance systems, smart device pairing (e.g., Bluetooth fast pairing), electronic tag read/write operations, industrial equipment identification, and medical device data synchronisation.

(3) Sub-GHz Evaluation Board: Specialising in Long-Range, Low-Speed Communication

Designed for wide-area communication requiring long-range, low-speed, and low-power operation, the Renesas Sub-GHz evaluation board operates across the 860MHz to 920MHz frequency band (adaptable to regional requirements). It supports FSK, GFSK, LoRa modulation schemes. The core representative model is the R9A06G062GNP evaluation board, compatible with MCU series including RL78/G1H and RX21A. It caters to scenarios requiring wide-area coverage such as smart metering and smart cities.

1. Core Hardware Configuration

- MCU and RF Core: Incorporates a high-performance Sub-GHz transceiver, with select models integrating Arm® Cortex-based MCUs. Clock speeds are adaptable to requirements, delivering robust interference resistance. The R9A06G062GNP evaluation board achieves transmit output power of +14 dBm equivalent radiated power and minimum receive sensitivity of -110 dBm (at 50 kbps in FSK mode), ensuring reliable communication in complex environments (e.g., building obstructions, industrial interference).

- Communication characteristics: Compliant with IEEE 802.15.4-2020 standard, supporting 50/100 kbps (FSK) and 300 kbps (OFDM) data transmission rates; - Integrates protocol stacks certified for Wi-SUN FAN 1.1 and Wi-SUN HAN 2.0, enabling multi-hop communication via mesh network topologies to significantly extend coverage; certified to Japanese Qualified Technology Standards and EU CE certification, directly usable as a Wi-SUN Alliance Certified Test Bed Unit (CTBU).

- Power Consumption and Expansion: Supports low-power sleep mode, suitable for battery-powered or solar-powered scenarios. For instance, Neona's data acquisition unit utilises the RZ/A1H MPU and RL78/G1H MCU to achieve ultra-low power consumption at 400MHz. Features standardised expansion interfaces for connecting peripherals such as sensors and displays, supporting multi-node networking tests.

2. Software Support

Supports Renesas FSP software package, integrating complete Sub-GHz and Wi-SUN protocol stacks alongside mainstream wide-area network protocols like LoRaWAN. Provides network configuration sample code and data transmission examples, with customisable communication parameters (e.g., rate, power, frequency band). Compatible with mainstream IDEs, featuring RF performance debugging and power consumption optimisation tools for real-time monitoring of communication range and signal strength, aiding developers in refining network solutions.

3. Typical Application Scenarios

Smart metering devices including electricity, water, and gas meters; smart city applications (intelligent street lighting, environmental monitoring nodes); industrial IoT (remote equipment monitoring, wireless meter reading); agricultural IoT (soil moisture monitoring, pest and disease surveillance); and outdoor asset tracking – all requiring long-range, low-speed communication.

(IV) Wi-Fi MCU Evaluation Board: Addressing High-Speed Wireless Networking Demands

Renesas' Wi-Fi MCU evaluation board addresses high-speed, high-bandwidth wireless networking requirements, supporting mainstream standards including Wi-Fi 6 while delivering low power consumption and robust security. The flagship model EK-RA6W1 integrates Wi-Fi RF and MCU cores within the RA6W1 series, eliminating the need for external Wi-Fi modules and simplifying hardware design.

1. Core Hardware Configuration

- MCU and Wi-Fi Core: EK-RA6W1 incorporates an RA6W1 series MCU featuring an Arm® Cortex®-M33 core operating at 160MHz, with 704KB SRAM, 8MB QSPI Flash, and 8MB pSRAM; Integrated dual-band Wi-Fi 6 RF module supporting 802.11a/b/g/n/ac/ax protocols across 2.4/5GHz bands. 1x1 MIMO architecture delivers speeds up to 115Mbps at 20MHz bandwidth. Supports core Wi-Fi 6 features including OFDMA and TWT to enhance network throughput and connection stability.

- RF and Security: Integrated dual-band antenna eliminates the need for additional RF circuit design; supports security protocols including WPA/WPA2-Enterprise/Personal, WPA2 SI, WPA3 SAE, and OWE. Incorporates encryption algorithms such as AES, DES/3DES, and CHACHA, alongside a TRNG true random number generator to safeguard wireless communications. Suitable for high-security scenarios like smart homes and industrial control systems.

- Expansion and Debugging: Features a separated mainboard and daughter card design for streamlined software application development and testing. Equipped with standardised expansion interfaces including mikroBUS™, Pmod™, and Arduino® UNO for rapid integration of peripherals such as sensors, displays, and storage modules. Features integrated power consumption analysis circuitry enabling low-power measurement down to 1µA in sleep mode, with support for RF testing to facilitate performance optimisation and cloud service integration evaluation.

- Peripheral Interfaces: Features extensive peripheral interfaces including 2x SPI, 3x UART, 2x I²C, SDIO 3.0 (Device mode), 12-bit ADC, I²S, PDM, and PWM, alongside up to 28 GPIOs to accommodate diverse peripheral connectivity requirements; operating temperature range spans -40°C to 85°C, suitable for industrial and outdoor environments.

2. Software Support

Supports Renesas FSP software package, integrating a complete Wi-Fi 6 protocol stack. Provides AP (hotspot), STA (client), and AP+STA hybrid mode configurations, supporting core functions including Wi-Fi connection management, data transmission, and power consumption optimisation. Provides cloud connectivity sample code (e.g., Alibaba Cloud, AWS) for rapid device networking and cloud platform integration. Compatible with IDEs such as IAR and Keil, featuring graphical configuration tools to simplify Wi-Fi parameter and MCU peripheral setup, thereby reducing development complexity.

3. Typical Application Scenarios

Smart home devices (smart televisions, smart air conditioners, robotic vacuum cleaners), industrial control (remote equipment monitoring, data uploads), smart gateways, portable Wi-Fi-controlled devices (RGBW lighting), Matter-compatible sensor modules, automated pet doors and tracking systems, and other high-speed wireless networking scenarios.