company blog about Supply Samtec High Density Array Connectors:AcceleRate HP Series,SEARAY™ Series,LP Array™ Series,SI-FLY HD Series

Supply Samtec High Density Array Connectors:AcceleRate HP Series,SEARAY™ Series,LP Array™ Series,SI-FLY HD Series

Shenzhen Mingjiada Electronics Co., Ltd. is a professional company engaged in the supply of electronic components, the main products include integrated circuits, 5G chips, new energy ICs, Internet of Things ICs, Bluetooth ICs, Telematics ICs, automotive ICs, automotive grade ICs, communication ICs, artificial intelligence ICs, etc. In addition to the supply of memory ICs, sensor ICs, microcontroller ICs, transceiver ICs, Ethernet ICs, WiFi chips WiFi chips, wireless communication modules, connectors, etc. The company is committed to providing global customers with high quality electronic components and solutions, which are widely used in communication, consumer electronics, industrial control, automotive electronics and other fields.

Samtec high-density array connectors feature a variety of pitches, stack heights, and configurations for maximum routing, grounding, and design flexibility.

AcceleRate HP Series
AcceleRate® HP 0.635 mm pitch arrays feature 112 Gbps PAM4 extreme performance and a flexible open-pin-field design.

Features
0.635 mm pitch open-pin-field array
56 Gbps NRZ/112 Gbps PAM4 performance
Cost optimized solution
Low-profile 5 mm and up to 10 mm stack heights
Up to 400 total pins available; roadmap to 1,000+ pins
Data rate compatible with PCIe® 6.0/CXL® 3.2 and 100 GbE
Analog Over Array™ capable

Product：APM6，APF6，APF6-RA，GPSO，CPSK，GPPK

SEARAY™ Series
These high-speed, high-density open-pin-field arrays allow maximum grounding and routing flexibility.

Features
Maximum routing and grounding flexibility
Lower insertion/extraction forces vs. typical array products
56 Gbps PAM4 performance
Up to 560 I/Os in open pin field design
1.27 mm (.050") pitch
Rugged Edge Rate® contact system
Can be “zippered” during mating/unmating
Solder charge terminations for ease of processing
Meets Extended Life Product™ (E.L.P.™) standards
Analog Over Array™ capable
7–18.5 mm stack heights
Vertical, right-angle, press-fit
Elevated systems to 40 mm
85 Ω systems

Product：SEAF，SEAM，SEAF-RA，SEAM-RA，SEAMP，SEAFP，SEAFP-RA，SEAR，SEAMI，JSO，GPPK，GPSK

LP Array™ Series
These low profile open-pin-field arrays feature stack heights down to 4 mm with up to 400 total I/Os.

Features
4 mm, 4.5 mm, 5 mm stack heights
Up to 400 I/Os
4, 6 and 8 row designs
.050" (1.27 mm) pitch
Dual beam contact system
Solder crimp termination for ease of processing
56 Gbps PAM4 performance
Analog Over Array™ capable

Product：LPAF，LPAM，JSO

SI-FLY HD Series
Si-Fly® HD co-packaged and near-chip systems provide the highest density 224 Gbps PAM4 solution in today's market.

Features
High-density mezzanine arrays feature 64 differential pairs per square inch
Mezzanine arrays route an extremely high number of transmission lines from one PCB to the next
Surface mount reflow technology to the PCB
High-density 224 Gbps PAM4 co-packaged and near-chip (ASIC adjacent) cable systems
PCIe® 7.0 capable
Co-packaged offers the lowest loss signal transmission from the package to the front panel or backplane while providing the highest density
Eye Speed® Hyper Low Skew Twinax cable technology supports 224G signaling with an industry leading 1.75 ps/m max intra-pair skew
Placement of Flyover® cable solutions on, or near, the chip package improves transmission line density and extends signal reach in high-performance applications

Product：SFBF，SFBM，SFCC，SFCM，SFNC，SFNM-L