company blog about Supply Silicon Labs Low-Power Bluetooth Solutions:SiBG301 Series 3 SoC,EFR32BG2B Series 2 SoC

Supply Silicon Labs Low-Power Bluetooth Solutions:SiBG301 Series 3 SoC,EFR32BG2B Series 2 SoC

Shenzhen Mingjiada Electronics Co., Ltd., a specialist distributor of wireless IoT chips, stocks two major low-power Bluetooth SoC platforms: the SiBG301 Series 3 SoC and the EFR32BG2B Series 2 SoC. We provide genuine chips, sample development and bulk supply services for IoT projects such as smart homes, smart lighting, asset tracking, industrial sensing, and electronic price tags. The company also operates an electronic component stock buy-back service, addressing both supply chain procurement and stock liquidation needs.

I. SiBG301 Series 3 Low-Power Bluetooth SoC

The SiBG301 Series 3 forms part of Silicon Labs’ third-generation Wireless Gecko platform. It is deeply optimised for mains-powered IoT devices, featuring high-performance computing power, Bluetooth Mesh networking and high-level hardware security, and is suitable for applications such as smart lighting, smart sockets and building automation.

Core Hardware: Equipped with a 150 MHz ARM Cortex-M33 core, featuring a DSP and floating-point unit; up to 4 MB of secure XIP QSPI Flash and 512 KB of RAM, meeting the demands of complex Bluetooth Mesh networking and the operation of multiple applications.

RF Performance: 2.4GHz RF with a maximum transmit power of +10dBm; BLE 1Mbps receive sensitivity of –98.6dBm, reaching –106.8dBm in 125kbps mode, delivering excellent communication range and interference resistance.

Protocols and Security: Supports Bluetooth LE, Bluetooth Mesh and proprietary 2.4 GHz protocols; integrates the Secure Vault™ High security engine, certified to the highest PSA Certified Level 4 security standard, with hardware-accelerated AES-256, ECC and SHA-2 encryption to ensure the security of device firmware and data.

Peripheral Highlights: Integrated LED pre-driver, 7-channel enhanced PWM, 12-bit ADC, temperature sensor, QSPI, I²C and USART; available in various QFN32/QFN40 packages; some models feature a built-in PIXELRZ single-wire LED interface, significantly reducing BOM costs and PCB area for lighting solutions.

Typical Applications: Suitable for smart LED lighting, smart home switches and sockets, smart building gateways, and Power over Ethernet (PoE) mesh node devices.

II. EFR32BG2B Series 2 Ultra-Low-Power Bluetooth 6 SoC

The EFR32BG2B Series 2 is Silicon Labs’ most power-efficient Bluetooth SoC, designed specifically for battery-powered IoT end devices. It offers native support for Bluetooth 6 and integrates Bluetooth Channel Sounding, making it ideal for location-aware battery-powered devices.

Core hardware: 80 MHz ARM Cortex-M33 core, up to 1 MB Flash and 128 KB RAM; dual-output buck DC-DC power supply architecture; EM2 sleep mode (with RAM retention) with current as low as 1.1 μA; active current reduced by 14–15% compared to the previous-generation MCU, significantly extending the service life of button-cell battery-powered devices.

RF and Positioning: A complete Bluetooth 6 protocol stack, supporting Bluetooth Channel Sounding distance measurement, as well as Mode 3, NADM and Inline PCT, enabling high-precision device distance sensing; also supports a proprietary 2.4 GHz wireless protocol.

Extensive integrated peripherals: Built-in CAN-FD, dual 12-bit ADCs, 4-channel LED sink drivers and a variable resistive load (VRL) reduce the need for external components and simplify hardware design; equipped with the Secure Vault™ High hardware security subsystem and hardware cryptographic acceleration to protect against firmware tampering and key theft.

Typical Applications: Suitable for battery-powered IoT devices such as electronic shelf labels (ESLs), asset tracking tags, smart locks, wireless sensors, wearable devices, industrial monitoring and on-board diagnostics.

Mingjiada Electronics’ Supply Advantages

Guarantee of Genuine Products: Stock available from immediate delivery; all products sourced directly from original manufacturers; third-party testing supported; complete traceability documentation provided; no refurbished or loose new components.

Flexible Supply Models: We support small-batch sample cutting for R&D, as well as high-volume orders for tape-and-reel or full rolls, catering to different stages from early development to mass production; with warehouses in Shenzhen and Hong Kong, we can facilitate rapid domestic and cross-border shipments.

Competitive Pricing and Rapid Delivery: Through efficient supply chain management, we offer highly competitive prices and shortened lead times to meet customers’ requirements for cost-effectiveness and time efficiency, ensuring products are delivered to customers on time.