company blog about Supply TI Long Range Sub-1 GHz Products:RF FEM,Sub-1 GHz Transceiver,Sub-1 GHz Wireless MCU

Supply TI Long Range Sub-1 GHz Products:RF FEM,Sub-1 GHz Transceiver,Sub-1 GHz Wireless MCU

Shenzhen Mingjiada Electronics Co., Ltd. is an authorised independent distributor of globally renowned electronic component brands, specialising in the distribution of products from over 500 leading manufacturers. The company maintains stable and reliable supply channels, ensuring that all products are sourced through official channels and are of guaranteed quality.

Main Products: Integrated Circuits (ICs), 5G chips, new energy ICs, Internet of Things (IoT) chips, Bluetooth chips, automotive chips, AI ICs, Ethernet ICs, memory chips, sensors, IGBT modules and various other products. With ample stock, highly competitive prices and rapid delivery capabilities, we are committed to providing high-quality electronic component supply services to end-users and distributors.

Service Advantages

Comprehensive product range, covering applications from low-power to high-power

Stable supply channels, ensuring all products are genuine and sourced directly from manufacturers

Significant inventory advantages, with ample stock of standard models to shorten customer lead times

Highly competitive pricing, offering the best market prices through the benefits of large-scale procurement

Flexible procurement options, supporting sample requests, small-batch trials and bulk orders

Global logistics network, enabling rapid worldwide delivery

I. Sub-1 GHz RF Front-End Modules: Highly Integrated RF Enhancement Solutions

TI’s Sub-1 GHz RF front-end modules are designed to enhance the performance of basic RF transceiver chips. In a System-in-Package (SiP) form factor, they integrate power amplifiers (PA), low-noise amplifiers (LNA), RF matching networks, filter circuits and other core peripherals in a System-in-Package (SiP) form. Eliminating the need for complex external RF design, these modules can substantially enhance the transmission power and reception sensitivity of wireless communications, significantly extending transmission range and improving interference immunity, whilst simultaneously lowering the barriers to hardware R&D and simplifying PCB design. These modules are characterised by plug-and-play functionality, RF-free tuning, long-range gain and high stability, making them the preferred solution for rapidly enhancing the wireless performance of mass-produced products.

1. Key Technical Advantages

- Long-range transmission gain: Integrated high-power amplification circuits can boost transmission power to the +20 dBm level, extending transmission range by 2–3 times compared to standard transceiver chips. Communication distances in open environments can reach several thousand metres, making them ideally suited for outdoor long-range networking scenarios.

- High Receive Sensitivity: A built-in low-noise amplifier effectively reduces the background noise in the RF receive chain, enhancing the ability to capture weak signals and significantly optimising communication stability in complex, obstructed environments.

- Minimalist Hardware Design: Integrates a complete set of RF matching and filtering circuits, eliminating the need for engineers to manually tune RF parameters. This significantly shortens the R&D cycle, reduces the risk of RF tuning failures, and meets the demands of mass production.

- Ultra-low power consumption: An optimised power management architecture ensures extremely low power consumption in standby and sleep modes, balancing high RF performance with the low-power battery life requirements of IoT devices, making it suitable for battery-powered terminals.

- Comprehensive certification: The entire range of modules has obtained all major global RF certifications, including FCC and CE, eliminating the need for repeated RF certification of the complete device and enabling rapid deployment in both domestic and international markets.

2. Key Representative Models

CC1312PSIP: TI’s classic Sub-1 GHz system-in-package (SiP) RF front-end module, integrating a high-performance power amplifier. Suitable for low-frequency, long-range networking, it is compatible with TI’s full range of Sub-1 GHz transceivers and wireless MCUs. Supporting mainstream ISM bands at 315 MHz, 433 MHz, 868 MHz and 915 MHz, it enables rapid enhancement of device communication range and is widely used in building security and industrial sensing terminals.

CC1352P7: A high-performance, enhanced integrated RF front-end module supporting ultra-high transmit power of +20 dBm. It incorporates Edge AI capabilities for lightweight computing, balancing long-range communication with local data processing. Compatible with multiple frequency bands, including Sub-1 GHz and 2.4 GHz, it is suitable for high-reliability applications such as smart grids and outdoor wide-area IoT networks.

3. Typical Application Scenarios

Outdoor long-range wireless sensor nodes, smart remote meter reading devices for water, electricity and gas, wide-area networking terminals for industrial sites, building security alarm systems, rural IoT coverage equipment, and low-power, long-range remote control devices.

II. Sub-1 GHz Transceiver: A Pure RF Communication Core with High Flexibility

TI’s Sub-1 GHz standalone transceiver is a pure RF functional chip with no built-in MCU, dedicated to delivering high-frequency, high-stability and low-power RF signal transmission and reception capabilities, offering exceptional design flexibility. Users can freely select a host MCU, processor and RF front-end circuitry to build differentiated wireless systems according to their requirements, making them suitable for product design scenarios requiring customised host architectures, minimalist RF circuits and optimal cost control. These chips support multi-band programmable configuration and multi-protocol customisation, serving as the core RF foundation for customised industrial wireless devices.

1. Key Technical Advantages

- Wide-band programmability: Covers the full range of mainstream Sub-1 GHz ISM bands from 300 MHz to 928 MHz, supporting on-demand configuration for common bands such as 315 MHz, 433 MHz, 868 MHz and 915 MHz, and adapting to spectrum regulations in different regions worldwide.

- Ultra-high reception sensitivity: Utilising an ultra-low-noise RF architecture, reception sensitivity reaches -120 dBm or higher, offering outstanding interference resistance in weak-signal environments and excellent communication stability in complex industrial settings and areas with architectural obstructions.

- Ultra-low power consumption: Supports multiple power consumption modes including sleep, standby, receive and transmit; sleep mode power consumption is in the nanoampere range, making it ideally suited for battery-powered IoT terminals requiring long-term battery life.

- Highly flexible protocol adaptation: Supports various modulation schemes including 2-(G)FSK, OOK and ASK; is compatible with the TI 15.4-Stack proprietary protocol; and allows for the customisation of proprietary communication protocols to meet a wide range of bespoke wireless communication requirements.

- Minimal peripheral circuitry: The chip integrates most RF functional circuits; operation requires only a small number of capacitors, resistors and crystal oscillators, resulting in a small PCB footprint that is well-suited to compact device designs.

2. Key Representative Models

CC1101: TI’s classic, best-selling Sub-1 GHz general-purpose transceiver and the most widely used pure RF chip in the industry. Supporting operation across a wide frequency band of 300–928 MHz, it offers extremely low power consumption, stable performance and controllable costs. Suitable for a wide range of short-, medium- and long-range proprietary wireless communication scenarios, it is the mainstream choice for consumer-grade and industrial-grade low-power wireless devices.

3. Typical Application Scenarios

Customised industrial wireless sensing devices, compact low-power remote control terminals, wireless access control systems, environmental monitoring nodes, low-cost smart meter reading modules, and differentiated wireless products requiring independent pairing with a host controller.

III. Sub-1 GHz Wireless Microcontrollers (MCUs): Single-Chip Integrated System Solutions

TI’s Sub-1 GHz wireless MCUs are highly integrated single-chip solutions comprising an MCU core, Sub-1 GHz RF transceiver circuitry and peripheral interfaces. With no need for external RF chips, a single chip can handle the full range of functions—including data acquisition, processing and wireless communication—making this the product category within TI’s Sub-1 GHz portfolio that offers the highest level of integration and optimal R&D efficiency. The entire range is based on the Arm Cortex-M architecture, balancing computing power, low power consumption and wireless performance, whilst supporting multiple IoT protocol standards and being compatible with the vast majority of standardised IoT end devices.

1. Key Technical Advantages

- Full-featured single-chip integration: Integrates a microcontroller core, RF transceiver, memory units, GPIO, UART, SPI, I²C and a full suite of peripherals, eliminating the need for external RF components, thereby significantly simplifying hardware circuitry and reducing the failure rate of the entire device.

- Standardised multi-protocol compatibility: Native support for mainstream Sub-1 GHz IoT protocols such as IEEE 802.15.4g, 6LoWPAN, MIOTY, Wi-SUN and TI 15.4-Stack; certain models are compatible with multiple protocols including Zigbee, Thread and Bluetooth Low Energy, making them suitable for standardised networking scenarios.

- High-performance, low-power computing: Equipped with a 48 MHz Arm Cortex-M4/M3 core supporting floating-point operations, it meets the requirements for data processing, protocol parsing and the execution of lightweight algorithms, whilst maintaining ultra-low power consumption in both active and sleep modes.

- Long-range, highly reliable communication: Features a built-in high-performance RF circuit, paired with an optional integrated PA/LNA, delivering a maximum transmit power of +20 dBm. This ensures long communication ranges and strong signal penetration, making it suitable for complex operating environments.

- Comprehensive ecosystem support: Leveraging TI’s unified SimpleLink software ecosystem, it provides mature SDKs, protocol stacks, development tools and technical documentation to support rapid development, debugging and mass production deployment.

2. Key Representative Models

CC1311R3/CC1311P3: Entry-level, cost-effective Sub-1 GHz wireless MCUs based on the Cortex-M4 core, integrating 352 KB of flash memory and ultra-low-leakage SRAM. They support mainstream Sub-1 GHz protocol stacks; the P3 model features a built-in power amplifier, eliminating the need for an external RF front-end. Balancing cost and long-range performance, they are suitable for mass-produced consumer and light industrial IoT devices.

CC1312R: A classic multi-protocol Sub-1 GHz wireless MCU, optimised for long-range, low-power networking. It supports wide-area IoT protocols such as Wi-SUN, MIOTY and 6LoWPAN, and is widely used in smart meters, building automation and low-power medical sensing devices.

CC1350: A low-cost dual-band wireless MCU that simultaneously supports Sub-1 GHz and 2.4 GHz RF bands. Based on the Cortex-M3 core, it is suitable for hybrid scenarios requiring flexible switching between dual bands, balancing short-range high-speed and long-range low-speed communication.

CC1352R/CC1352P7: High-performance, multi-protocol flagship models supporting Sub-1 GHz and 2.4 GHz dual-band operation. They are compatible with all mainstream IoT protocols, including Zigbee, Thread, Bluetooth 5.2 and Wi-SUN. The P7 model features a high-power RF front-end and integrates lightweight Edge AI computing capabilities, making it suitable for industrial-grade, highly reliable and intelligent networking equipment.

CC1354P10: A new-generation, high-performance multi-frequency wireless MCU supporting the latest protocols such as Bluetooth 5.3, Amazon Sidewalk and Wi-SUN. It features comprehensive upgrades in RF performance, computing power and power consumption, and is suitable for high-end smart IoT and wide-area intelligent networking scenarios.

3. Typical Application Scenarios

Smart grid remote meter reading, building HVAC automation systems, security intrusion detection devices, industrial low-power sensor nodes, smart agriculture wide-area monitoring terminals, standardised IoT networking devices, and battery-powered smart terminals with ultra-long battery life.