company blog about [Supply] XCVM1802-1MSIVSVD1760 AMD Versal™ Prime Series - Versal Adaptive SoCs

Shenzhen Mingjiada Electronics Co., Ltd. [Supply] XCVM1802-1MSIVSVD1760 AMD Versal™ Prime Series - Versal Adaptive SoCs

Versal Prime Series Product Brief（XCVM1802-1MSIVSVD1760）：
XCVM1802-1MSIVSVD1760: AMD Versal™ Prime Series - Enabling High Data Throughput with the Industry’s Fastest DDR Memory Interface.

XCVM1802-1MSIVSVD1760: AMD Versal™ Prime Series - Provides a diverse set of compute engines, next-generation I/O, and integrated DDR controllers, enabling low-latency acceleration across a wide range of workloads.

XCVM1802-1MSIVSVD1760: The Versal Prime series combines PCIe® Gen5/Gen4 compliance, high-performance GPIO, 400G High-Speed Crypto (HSC) Engines*, and multirate Ethernet MACs supporting various Ethernet configurations to maximize connectivity and flexibility. Additionally, Versal Prime series devices feature rearchitected low-latency 32.75 Gb/s transceivers.

XCVM1802-1MSIVSVD1760: The Prime series is a highly integrated, multicore, heterogeneous compute platform that delivers breakthrough performance for a wide range of applications, including data center networking, storage, and wired communications, by enabling low-latency inline acceleration in devices optimized for connectivity.

Product Attributes Of XCVM1802-1MSIVSVD1760

Series: Versal™ Prime
Architecture: MPU, FPGA
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
RAM Size: 256KB
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 600MHz, 1.3GHz
Primary Attributes: Versal™ Prime FPGA, 1.9M Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1760-BFBGA, FCBGA
Supplier Device Package: 1760-FCBGA (40x40)
Number of I/O: 726

Processing Subsystem Features Of XCVM1802-1MSIVSVD1760

Application Processing Unit: Dual-core Arm® Cortex®-A72, 48 KB/32 KB L1 Cache with parity and ECC; 1 MB L2 Cache w/ ECC
Real-time Processing Unit: Dual-core Arm Cortex-R5F, 32 KB/32 KB L1 Cache, and 256 KB TCM with ECC
Memory: 256 KB On-Chip Memory With ECC
Connectivity: Ethernet (x2); USB 2.0 (x1); UART (x2); SPI (x2); I2C (x2); CAN-FD (x2)

Product Specifications Of  XCVM1802-1MSIVSVD1760

DSP Engines: 1,968

System Logic Cells:1,968K

LUT: 899,840

NoC Master / NoC Slave Ports: 28
DDR4 Memory Controllers: 4
PCIe® with DMA (CPM): 1 x Gen4x16
PCIe: 4 x Gen4x8
100G Multirate Ethernet MAC: 4
GTY Transceivers: 44

Applications Of XCVM1802-1MSIVSVD1760

Storage Acceleration

Data Center Network Acceleration

5G xHaul

Passive Optical Networks

Communications Test Equipment

Company URL: https://www.integrated-ic.com/

FAQ
Q. Are your products original?
A: Yes, all products are original, new original import is our purpose.
Q:Which Certificates do you have?
A:We are ISO 9001:2015 Certified Company and member of ERAI.
Q:Can you support small quantity order or sample?Is the sample free?
A:Yes,we support sample order and small order.Sample cost is different according to your order or project.
Q:How to ship my order? Is it safe?
A:We use express to ship,such as DHL,Fedex,UPS,TNT,EMS.We can also use your suggested forwarder.Products will be in good packing and ensure the safety and we are responsible to product damage to your order.
Q:What about the lead time?
A:We can ship stock parts within 5 working days.If without stock,we will confirm lead time for you based on your order quantity.