company blog about Supply Xilinx Virtex™ UltraScale+™ VU19P FPGAs:XCVU19P

Supply Xilinx Virtex™ UltraScale+™ VU19P FPGAs:XCVU19P

Shenzhen Mingjiada Electronics Co., Ltd. specialises in the sale of electronic components, we provide a rich selection of products, accurate supply chain management, as well as comprehensive technical support. The company is committed to providing customers with efficient, convenient, high-quality electronic components purchasing experience.

We mainly deal with a series of products such as: integrated circuit IC, 5G chip, new energy IC, IoT chip, Bluetooth chip, automotive chip, artificial intelligence IC, Ethernet IC, memory chip, sensors, IGBT module and so on.

Introducing the Xilinx Virtex™ UltraScale+™ VU19P FPGA
Xilinx introduces the Virtex™ UltraScale+™ VU19P, the world’s largest FPGA, to enable prototyping and emulation of the most advanced ASIC and SoC technologies, as well as the development of complex algorithms.

Xilinx Virtex™ UltraScale+™ VU19P Product Advantages
Virtex™ UltraScale+™ VU19P FPGA Highest capacity FPGA now in production by AMD

Xilinx Virtex UltraScale+ VU19P FPGAs enables prototyping and emulation of the most advanced ASIC and SoC technologies, as well as the development of complex algorithms. The VU19P FPGA provides the highest logic density and I/O count on a single device ever built by AMD, addressing new classes of demands in evolving technologies.

Key Features and Benefits
Highest Logic Capacity
9 million system logic cells allow designers to emulate and prototype larger-scale, more complex designs, and create customized test logic for test-equipment vendors.

I/O Capacity and Bandwidth
Massive I/O bandwidth is not only ideal for multi-FPGA interconnect but also allows engineers to connect a broad range of external memory types and rates to implement fast, deep storage of state information.

High-Speed Transceivers
80 GTY (28 Gb/s) transceivers offer up to 4.5 Tb/s transceiver bandwidth, which is suited for high port density test equipment and next-generation platforms using emerging interface standards and protocols.

Superior Cooling
Lidless packaging provides an optimal cooling solution that allows designers to push the limits of performance to the extreme. Deploying high-performance systems in the thermally-constrained environment is now easier than ever.

Application
> Emulation
> Prototyping
> Test & Measurement
> Data Center
> Wired Communications
> Aerospace & Defense