company blog about TI HSS-2HCS08EVM Daughter Card For Smart Fuse High-Side Switch

TI HSS-2HCS08EVM Daughter Card For Smart Fuse High-Side Switch

Shenzhen Mingjiada Electronics Co., Ltd., a renowned distributor of electronic components, now supplies the genuine TI HSS-2HCS08EVM Smart Fuse High-Side Switch Evaluation Sub-Card to the market. This is not merely a basic evaluation module but a bridge connecting advanced semiconductor technology with real-world automotive electronics applications, providing engineers with a complete hardware and software ecosystem for exploring next-generation power distribution solutions.

[Modular Evaluation Powerhouse: In-Depth Analysis of the HSS-2HCS08EVM Sub-Board]

The HSS-2HCS08EVM is not a standalone development board; it is a modular sub-board specifically designed for use with TI's HSS-HCMOTHERBRDEVM motherboard. This “motherboard + daughter card” architecture embodies exceptional flexibility and forward-thinking design. It enables engineers to evaluate various models, on-resistance values, and functionalities within TI's intelligent fuse high-side switch product range using a single hardware platform, significantly reducing hardware costs and evaluation time.

The core evaluation device on this HSS-2HCS08EVM daughter card is TI's TPS2HCS08-Q1, an automotive-qualified intelligent high-side switch. It integrates the protection and control functions traditionally provided by fuses, relays, and discrete circuits, representing the technological direction for next-generation power distribution systems.

【HSS-2HCS08EVM Core Features and Technical Innovations】

Advanced Intelligent Protection Capabilities: The TPS2HCS08-Q1 device showcased on the HSS-2HCS08EVM sub-card delivers programmable intelligent protection as its core advantage. Its configurable I²T (current-time squared) functionality simulates traditional fuse blowout curves, enabling reset without physical fuse replacement post-fault clearance – achieving ‘intelligent’ circuit protection.

Integrated Diagnostic and Monitoring Capabilities: The chip incorporates a high-precision ADC (Analogue-to-Digital Converter), enabling engineers to monitor and plot load current and voltage curves in real-time via accompanying software. This deep visualisation capability provides invaluable data support for system optimisation and fault diagnosis.

Addressing complex load scenarios: To tackle common power-up surges in capacitive loads within automotive electronics, this device supports adjustable current-limiting modes. This permits smooth, controlled charging of load capacitors, effectively suppressing inrush currents and enhancing system reliability.

[HSS-2HCS08EVM Complete Evaluation Ecosystem]

To fully utilise this daughter card's capabilities, it must be inserted into the HSS-HCMOTHERBRDEVM motherboard. The motherboard incorporates an Arm Cortex-M4F-based TM4C123GH6 MCU, functioning as a USB-to-SPI bridge between the PC and daughter card. Users can effortlessly configure the high-side switch, perform real-time operations, and evaluate performance by running TI's graphical host software, ‘Smart Fuse Configurator,’ on their PC, significantly lowering development barriers.

【HSS-2HCS08EVM Design Philosophy: Core Component of Modular Evaluation Ecosystem】

The HSS-2HCS08EVM's design philosophy centres on efficiency and flexibility. It is not an independent evaluation board but rather a daughter card requiring pairing with the HSS-HCMOTHERBRDEVM motherboard. This ‘motherboard + daughter card’ modular architecture embodies the ingenuity of TI's smart fuse evaluation ecosystem.

Flexible Evaluation Platform: A single HSS-HCMOTHERBRDEVM main board serves as a universal host. By swapping different daughter cards, engineers can evaluate TI's diverse range of intelligent high-side switch chips—varying in specifications, on-resistance, and current ratings. This significantly reduces hardware costs and evaluation time, making side-by-side performance comparisons effortless.

Plug-and-play convenience: Sub-boards connect to the mainboard via standard slots. Engineers need only ensure alignment of the pin 1 reference point to rapidly complete hardware setup. The pre-installed TM4C123GH6 microcontroller (based on the Arm Cortex-M4F core) acts as a robust USB-to-SPI bridge, enabling seamless communication between the switch chip on the sub-board and host software.

Complete Kit Support: A standard evaluation kit typically includes the HSS-HCMOTHERBRDEVM motherboard with pre-burned firmware, a specific daughter card (such as the HSS-2HCS08EVM), and necessary connection cables. TI even offers a ‘blank’ daughter card, the HSS-HCS-BLANKEVM, for users to solder their own chips or utilise in destructive testing, demonstrating the evaluation system's openness and scalability.

【HSS-2HCS08EVM Core Capabilities: From Hardware Integration to Software Configurability】

At the heart of the HSS-2HCS08EVM daughter card lies the integrated TPS2HCS08-Q1 automotive-grade intelligent high-side switch chip. Together with the main board, this forms a feature-rich evaluation system whose core strengths reside in several configurable intelligent functions:

Configurable I²T Protection: This serves as the core replacement for traditional fuses. Engineers can precisely configure the chip's current-time squared protection curve via software, ensuring perfect alignment with the physical characteristics of specific wire gauges. This achieves equivalent protection to conventional fuses while eliminating the inconvenience of replacement after fuse blowout.

Integrated ADC and Diagnostic Monitoring: The chip's internal analogue-to-digital converter (ADC) enables real-time, high-precision monitoring of load current and supply voltage. This data can be read via the SPI interface and visualised through intuitive graphs using TI's Smart Fuse Configurator host software, aiding engineers in analysing circuit dynamics and diagnosing potential faults.

Adjustable Inrush Current Management: Addressing common inrush current issues with capacitive loads (such as ECU modules requiring power-up buffering), the daughter card supports an adjustable current limit mode. This feature enables smooth, controlled charging of load capacitance, effectively preventing false protection triggers or power network impacts caused by inrush currents.

Comprehensive Hardware Access and Power Design:

Test Points: Both the mainboard and daughter cards provide extensive, fully accessible test points and connectors. This enables engineers to readily access all SPI communication lines, fault indication signals, and power rails at every level, facilitating in-depth debugging using oscilloscopes and logic analysers.

Flexible Power Supply: The motherboard integrates an automotive-grade LMR43610-Q1 synchronous buck regulator, capable of converting a wide input voltage range of 3V to 36V into 3.3V to power the internal control circuit (VDD) of the smart switch chip. When an external precision power supply is required, this built-in regulator can be disabled via a jumper setting, offering exceptional design flexibility.

【HSS-2HCS08EVM Application Scenario: Empowering Next-Generation Automotive Electronics】

The intelligent high-side switch technology evaluated by the HSS-2HCS08EVM precisely targets the core domain of automotive electronics architecture transformation:

Zonal Electronic Control Units (ECUs): Within domain-controlled architectures, intelligent centralised power distribution and protection are required for numerous actuators (e.g., lighting, motors, sensors). The precise diagnostics and configurable protection features of smart high-side switches make them an ideal solution for achieving this objective.

Intelligent Power Distribution Modules (PDM): Replacing traditional relays and fuse boxes, these enable contactless, programmable power distribution systems. Load protection characteristics can be modified via software, supporting OTA updates and laying the foundation for function-defined vehicles.

Body Control Module (BCM): Controls body functions including windows, seats, and windscreen wipers. The load diagnostics provided by smart switches (e.g., open-circuit, short-circuit, and overtemperature detection) significantly enhance vehicle diagnostics and maintenance efficiency.

Mingjiada Electronics maintains long-term supply of other TI evaluation board components, including but not limited to the following models:

TMUX-8RQX-EVM

TMUX1575EVM

TMUX646EVM

TMUXRTJ-RRQEVM

TPS22902BEVM

TPS22922BEVM

TPS22922EVM

TPS272C45EVM

TPS7H2221EVM

TS3A227E-EVM

TS3DDR4000-EVM

TS3USB221EVM

TSU6721EVM

DS25CP102EVK