company blog about TI QFN16-DIP-EVM 16-Pin QFN To DIP Adapter Evaluation Module

TI QFN16-DIP-EVM 16-Pin QFN To DIP Adapter Evaluation Module

Shenzhen Mingjiada Electronics Co., Ltd., as a globally leading distributor of electronic components, provides customers with the QFN16-DIP-EVM evaluation module—an economical, flexible, and efficient solution. This 16-pin QFN-to-DIP adapter acts as a professional ‘chip translator’, converting signals from precision surface-mount devices (SMDs) into standard dual in-line package (DIP) interfaces suitable for traditional through-hole (TH) processes, significantly streamlining engineers' development workflows.

[QFN16-DIP-EVM Core Product: Engineered for Rapid Prototyping]

The QFN16-DIP-EVM is fundamentally positioned as a rapid, straightforward prototyping platform. Initially optimised for TI's four-channel operational amplifiers utilising the RUM-16 package (a 16-pin QFN variant), its design remains versatile enough to accommodate any chip sharing identical pinout and package dimensions.

The QFN16-DIP-EVM evaluation module is designed with the practical needs of engineers in laboratory environments in mind. Its architecture permits a standard evaluation board to be partitioned into multiple independent units, enabling a single EVM to support parallel prototyping and testing of up to eight devices with identical packaging. This significantly enhances R&D efficiency while reducing unit costs.

QFN16-DIP-EVM Key Features and Components

Core Features:

Low Cost and High Flexibility: Provides engineers with a universal platform for connecting any chip conforming to the pin configuration at an economical cost.

Seamless Compatibility: The module design allows direct insertion into standard DIP sockets or widely used solderless test boards (breadboards), making circuit assembly and modification exceptionally convenient.

Kit Contents:

One QFN16-DIP-EVM circuit board.

Two Samtec TS-132-G-AA terminal blocks for reliable, pluggable connections.

Performance and Application Value

For R&D engineers, the QFN16-DIP-EVM's value lies in effectively mitigating the technical risks and high debugging costs associated with directly soldering QFN chips. Through this module, engineers can:

Convenient Evaluation: Rapidly validate chip functionality and circuit performance before finalising the PCB design.

Simplified Debugging: Freely swap peripheral resistors and capacitors on the breadboard to flexibly adjust circuit parameters.

Accelerate learning: Provide students and beginners an intuitive pathway to engage with and study advanced packaging chips.

[QFN16-DIP-EVM Core Functionality: The Art of Package Conversion]

The package conversion evaluation module essentially acts as a physical ‘translator’ between different packaging formats. Within the semiconductor field, various packaging forms possess distinct advantages and disadvantages, yet debugging and testing tools are often designed around standard pin pitches.

The absence of traditional protruding pins in QFN packaging makes direct insertion into standard DIP sockets or solderless test boards challenging.

The QFN16-DIP-EVM evaluation module features a clever and practical design. It converts the 16-pin QFN package into a standard 0.1-inch pitch dual in-line package, enabling seamless integration of QFN devices into familiar testing environments.

The flexible design of the QFN16-DIP-EVM module renders it suitable not only for TI's quad operational amplifiers but also for any device employing the identical package.

A design highlight within the QFN16-DIP-EVM module is the “scoring” feature, enabling users to effortlessly separate a circuit board containing multiple devices into distinct single-device boards.

【QFN16-DIP-EVM Design Architecture: A Hardware Philosophy of Simplicity Without Simplification】

The overall structure of the QFN16-DIP-EVM evaluation module embodies Texas Instruments engineers' commitment to pragmatism. The module comprises a meticulously designed PCB board and two Samtec TS-132-G-AA terminal blocks.

This combination elegantly connects the ground pad beneath the QFN package and its surrounding pins to standard DIP pins.

The QFN16-DIP-EVM adopts a low-cost solution while delivering exceptional flexibility. This design philosophy permeates every aspect: supporting any pin configuration means it serves not only specific models but also functions as a universal test platform.

Regarding compatibility, the QFN16-DIP-EVM is fully compatible with common solderless test boards, significantly broadening its application scenarios. Engineers can rapidly assemble prototype circuits on breadboards without complex soldering tasks.

Notably, a single EVM can support prototyping for up to eight devices, a design that substantially enhances testing efficiency.

【QFN16-DIP-EVM Application Scenarios: From Laboratory to Educational Practice】

The QFN16-DIP-EVM finds extensive application across two primary domains:

Industrial R&D and Testing:

Within sectors such as communications equipment, automotive electronics, and industrial automation, engineers utilise this module to evaluate performance and conduct early prototype validation for QFN-packaged sensor interface chips, power management ICs, or RF front-end modules.

It proves particularly suitable during initial system integration phases for rapidly identifying compatibility issues between chips and peripheral circuits, thereby preventing complex faults arising from faulty package soldering.

Higher Education and Skills Training:

Within university courses such as electronic engineering and embedded systems, this module enables students to bypass complex SMT soldering equipment. By allowing direct circuit construction on breadboards, it focuses learning on understanding chip principles and developing circuit design capabilities, serving as an ideal teaching aid bridging theoretical knowledge with engineering practice.