company blog about TI SMALL-AMP-DIP-EVM Evaluation Module For Operational Amplifiers With Small-Size Package

TI SMALL-AMP-DIP-EVM Evaluation Module For Operational Amplifiers With Small-Size Package

Shenzhen Mingjiada Electronics Co., Ltd., as a professional electronic component distributor, provides customers with TI's SMALL-AMP-DIP-EVM small-package operational amplifier evaluation module.

The SMALL-AMP-DIP-EVM essentially functions as a high-precision ‘package adapter board’, reliably and stably routing the pins of compact packages – which are difficult to handle directly – to standard-pitch header pins. This enables engineers to effortlessly construct circuits on breadboards or test platforms, much like using traditional DIP (Dual In-line Package) configurations. It facilitates critical evaluations such as power supply testing, bandwidth measurement, and noise analysis, thereby translating the parameters from the chip datasheet into verifiable real-world circuit performance.

【Core Insights: The SMALL-AMP-DIP-EVM's Hardcore Capabilities】

This SMALL-AMP-DIP-EVM evaluation module stands as an indispensable engineer's ally, owing to its meticulous design and precise alignment with industry demands.

1. Extensive Package Compatibility: One Board, Multiple Uses

The SMALL-AMP-DIP-EVM's core advantage lies in its exceptional compatibility. A single board integrates support for eight industry-standard miniature packages, specifically:

Ultra-miniature package: DPW-5 (X2SON)

Small WSON package: DSG-8 (WSON)

SOT packages: DCN-8 (SOT), DDF-8 (SOT)

QFN packages: RUG-10 (X2QFN), RUC-14 (X2QFN), RGY-14 (VQFN), RTE-16 (WQFN)

This design approach eliminates the need for engineers to develop and solder separate evaluation boards for each distinct amplifier package. Whether evaluating TI's TLV900x series low-voltage operational amplifiers or other compatible-packaged devices such as instrumentation amplifiers and comparators, the same EVM board enables rapid prototyping, significantly reducing material and time costs.

【SMALL-AMP-DIP-EVM Design Analysis: An Elegant Transition from SMD to DIP】

The SMALL-AMP-DIP-EVM embodies a philosophy of minimalism and practicality. Its hardware structure is clearly defined, comprising two primary sections:

Package Adaptation Zone: The board features eight distinct zones, each corresponding to one of the aforementioned package types. Users simply solder the chip onto the designated pad matching the package type of the device under evaluation.

Standard Interface Zone: Each pin of every micro-package is internally routed via the PCB to a standard 32-pin dual-row header. This header, specified as Samtec TS-132-G-AA with a standard 2.54mm pitch, facilitates straightforward insertion into breadboards or connection to other standard DIP interface circuits.

For ease of use, the SMALL-AMP-DIP-EVM board employs a breakaway design. Pre-cut V-shaped separation lines are provided between different package areas on the full board. When only one package type is required, the engineer can gently snap along the cut line to separate the desired sub-board for independent use. This enhances circuit construction flexibility and saves space.

【Rigorous Hardware Design and Safety Assessment of SMALL-AMP-DIP-EVM】

The SMALL-AMP-DIP-EVM module design strictly adheres to signal integrity principles, ensuring minimal parasitic parameters (such as inductance and capacitance) introduced by the evaluation board itself. This guarantees measurement results accurately reflect the chip's performance. Each encapsulation area features independent layout, allowing users to effortlessly separate required sections via pre-cut lines on the PCB. The accompanying 32-pin header (Samtec part number TS-132-G-AA) provides robust electrical connections, establishing a solid hardware foundation for evaluating diverse devices including general-purpose operational amplifiers, instrumentation amplifiers, and comparators.

【SMALL-AMP-DIP-EVM Typical Application Scenarios: Empowering Cutting-Edge Technological Innovation】

The SMALL-AMP-DIP-EVM finds application across multiple high-tech sectors during the prototyping phase:

Industrial Sensors and Precision Measurement: Within industrial automation, it evaluates small-signal amplification circuits connected to pressure, temperature, or flow sensors, ensuring high-precision, low-noise signal conditioning within compact PLCs or sensor modules.

Portable Medical Electronics: Hearing aids and wearable health monitors (e.g., ECG patches) demand operational amplifiers with stringent size and power consumption constraints. This EVM serves as an ideal platform for evaluating ultra-low-power, small-package op-amps.

Automotive Electronics and ADAS: For screening and validating precision amplifiers compliant with AEC-Q100 standards in automotive-grade applications such as in-vehicle camera modules and ultrasonic radar sensor interfaces, meeting the automotive industry's stringent reliability and temperature requirements.

Consumer Electronics and IoT Nodes: Provides cost-effective, compact amplifier solutions for evaluating active noise cancellation circuits in TWS earbuds and voice wake-up modules in smart home devices.

Mingjiada Electronics maintains long-term supply of other TI evaluation board components, including but not limited to the following models:

SMALL-AMP-DIP-EVM

TAS2564YBGEVM-DC

TAS5822MEVM

THP210EVM

THS3001EVM

THS3091EVM

THS3095EVM

THS3120EVM

THS3202EVM

THS4022EVM

THS4131EVM

THS4302EVM

THS4303EVM

THS4521EVM

THS4531ADGKEVM