LTC4308IDD Low Voltage Hot Swappable Two Wire Bus Buffer DFN-8 Integrated Circuit Chip

The LTC4308 is a hot swappable 2-wire bus buffer in a DFN-8 package built for backplanes whose bus supplies run as low as 0.9 V, where ordinary buffers no longer meet the logic low requirement.

A minus 200 mV offset from the input to the output, combined with a plus 300 mV offset in the return direction, lets output side devices with a high VOL talk to low voltage devices on the input side.

Insertion behaviour is controlled: SDAOUT and SCLOUT are precharged to 1 V, and the input is connected only after ENABLE is high and a stop bit or bus idle condition is detected, so a card cannot corrupt a working bus.

If SDAOUT or SCLOUT stay low for 30 ms, the connection is broken automatically and up to 16 clock pulses are issued on SCLOUT to release the stuck bus, with reconnection once the bus is free.

The LTC4308 is rated to plus or minus 6 kV HBM ESD, operates over -40 to +85 degree C, is RoHS compliant and ships with full traceability. Samples and volume pricing are available on request.

• LTC4308IDD optimised for low voltage systems down to 0.9 V in DFN-8 package
• LTC4308 series in stock with full traceability and volume pricing
• Hot swappable bidirectional 2-wire bus buffer
• Minus 200 mV offset from input to output
• Plus 300 mV offset from output to input
• 30 ms stuck bus timeout
• Automatic disconnect and up to 16 clocks to free the bus
• Compatible with non-compliant VOL I2C devices
• Prevents SDA and SCL corruption during live insertion
• Isolates input SDA and SCL lines from the output side
• READY open-drain output for connection status
• 1 V precharge on SDAOUT and SCLOUT lines
• Plus or minus 6 kV human body model ESD protection
• DFN-8 package

• Low voltage backplanes below 1 V
• Live insertion of I/O cards
• Portable and handheld system buses
• Level shifting to low voltage logic
• Bus isolation for hot swap modules

Typical use is digitally controlled resistance and divider trimming in surface mount assemblies.

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