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Product Details:
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| Part Number: | CXDB3ABAM-MK | Density: | 8Gbit |
|---|---|---|---|
| Data Rate: | 3733Mbps | Operating Temperature: | -25°C To +85°C |
| Highlight: | 8Gbit LPDDR4X Memory,3733Mbps Memory IC Chip,Low Power Consumption FBGA-200 Package |
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| Density | 8Gbit |
|---|---|
| Type | LPDDR4/4X |
| Package | FBGA-200 |
| Data Rate | 3733Mbps |
| Operating Temperature Range | -25°C to +85°C |
| Part Number | Package |
|---|---|
| TLV9154QPWRQ1 | TSSOP14 |
| TJA1462BT/0Z | SOP8 |
| QCC-5124-0-CSP90-TR-00-0 | BGA |
| QCC-3046-0-WLNSP94B-TR-01-0 | BGA |
| MIMX8MN1CVPIZAA | FCBGA-306 |
| MIMX8MQ6CVAHZAB | BGA621 |
| STM32WB55REV6 | VFQFPN68 |
| 88Q2112-A2-NYD2A000 | QFN |
| MCZ33905DS5EK | HSSOP32 |
| MCZ33905DD5EK | HSSOP54 |
| MC33984CHFKR2 | QFN-16 |
| SP5746CSK1AMKU6 | 176-LQFP |
| S9KEAZN64AMLHR | LQFP64 |
| SPC5748GSK1MMJ6 | BGA |
| QCA7005-AL33 | QFN |
| APL1098 | QFN |
| SKY58271-19 | DFN |
| SKY58270-17 | QFN |
| 338s00770 | BGA |
| 338s00762 | BGA |
| STB601A05 | BGA |
| STM32L496QGI6 | UFBGA-132 |
| 343S00404 | BGA |
| W25Q256JWEIQ | WSON8 |
| BMA456 | LGA |
| LCMXO2-2000ZE-1UWG49ITR | WLCSP49 |
| PI3USB102EZLEX | TQFN10 |
| 338S00517 | BGA |
| MAXM17552AMB | USLIC-10 |
| TUSB544IRNQR | WQFN-40 |
| STM32L452CCU6 | UFQFN-48 |
Contact Person: Sales Manager
Tel: 86-13410018555
Fax: 86-0755-83957753