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SM-8550-0-MPSP1581-MT-02-0-AC AI Processor Chip SM8550 Snapdragon 8 Gen 2 Mobile Platform with 4 nm Process 8-core Kryo CPU and LP-DDR5x Memory Support

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SM-8550-0-MPSP1581-MT-02-0-AC AI Processor Chip SM8550 Snapdragon 8 Gen 2 Mobile Platform with 4 nm Process 8-core Kryo CPU and LP-DDR5x Memory Support

SM-8550-0-MPSP1581-MT-02-0-AC AI Processor Chip SM8550 Snapdragon 8 Gen 2 Mobile Platform with 4 nm Process 8-core Kryo CPU and LP-DDR5x Memory Support
SM-8550-0-MPSP1581-MT-02-0-AC AI Processor Chip SM8550 Snapdragon 8 Gen 2 Mobile Platform with 4 nm Process 8-core Kryo CPU and LP-DDR5x Memory Support

Large Image :  SM-8550-0-MPSP1581-MT-02-0-AC AI Processor Chip SM8550 Snapdragon 8 Gen 2 Mobile Platform with 4 nm Process 8-core Kryo CPU and LP-DDR5x Memory Support

Product Details:
Place of Origin: CN
Brand Name: Original Factory
Certification: Lead free / RoHS Compliant
Model Number: SM-8550-0-MPSP1581-MT-02-0-AC
Payment & Shipping Terms:
Minimum Order Quantity: 10
Price: Contact for Sample
Packaging Details: BGA
Delivery Time: 5-8 work days
Payment Terms: T/T,L/C,Western Union
Contact Now

SM-8550-0-MPSP1581-MT-02-0-AC AI Processor Chip SM8550 Snapdragon 8 Gen 2 Mobile Platform with 4 nm Process 8-core Kryo CPU and LP-DDR5x Memory Support

Description
Part Number: SM-8550-0-MPSP1581-MT-02-0-AC CPU: 8-core Kryo Processor
Technology: 4 Nm Process Memory: Support For LP-DDR5x Memory Up To 4200 MHz
Package: BGA Type: Snapdragon™ Premium 5G SoC
Highlight:

4 nm Process AI Processor Chip

,

8-core Kryo processor Snapdragon 8 Gen 2 Mobile Platform

,

LP-DDR5x memory 5G SoC

SM-8550-0-MPSP1581-MT-02-0-AC AI Processor Chip SM8550 Snapdragon 8 Gen 2 Mobile Platform
Product Overview

The SM-8550-0-MPSP1581-MT-02-0-AC is a next-generation Snapdragon™ premium 5G System-on-Chip featuring an integrated modem. Built on an advanced 4nm process technology, this mobile platform delivers exceptional performance and power efficiency for premium mobile devices.

Technical Specifications
Type Snapdragon 8 Gen 2 Mobile Platform
CPU 8-core Kryo processor
Technology 4 nm Process
USB Version 3.1 with USB Type-C Support
Storage UFS 4.0
Memory Support for LP-DDR5x memory up to 4200 MHz
Memory Density Up to 24 GB
Advanced AI Features
  • Hexagon Processor: First Snapdragon Mobile Platform with hardware-based micro tile inferencing for complex neural networks
  • Hexagon Direct Link: Enables all cores to work faster and more efficiently via physical link to Hexagon for maximum performance
  • Sensing Hub: Dual-AI processors powering new experiences like direct-to-app voice assistance
  • Always-on Capability: Ultra-low power operation for audio, sensors and always-sensing camera
  • Precision Support: Comprehensive support for all precisions (INT4, INT8, INT16, FP16)
Snapdragon Sight™ Imaging Technology
  • Cognitive ISP: First-ever Snapdragon Mobile Platform with cognitive image signal processing
  • Real-time Semantic Segmentation: Recognizes and optimizes each aspect within photo and video frames
  • Always-Sensing Camera: AI-powered quick face detection with enhanced privacy features
  • Bokeh Engine 2: Professional-level sharpness, color, and depth processing
  • Pro Sight Video Capture: 5x larger file sizes for superior quality footage and professional editing
  • Quad Computational HDR Video Capture: Supports QDOL and Staggered HDR image sensors
  • AV1 Codec: Advanced video playback capabilities
Integrated Core Components
  • Kryo™ CPU: Built on Arm Cortex technology for superior processing performance
  • Adreno™ 740 GPU: Delivers peak graphics performance with exceptional energy efficiency
  • Spectra™ ISP: Provides ultimate photography and videography experiences
  • Adreno VPU 8550: High-quality, ultra-high-definition video encoding and decoding
  • Adreno 1295 DPU: Supports both on-device and external ultra-high-definition displays
  • 3G/4G/5G Modem: Integrated modem supporting millimeter wave and sub-6 GHz bands (Rel 16)
Additional Electronic Components Available
Part Number Package
AGIB027R31B2E3VR0 FBGA-3184
AGFD019R25A2E4X FBGA-2581
AGIB027R29A2E2VR3 2957-BGA
AGIB019R31B2E3E 3184-BFBGA
AGFB012R24C2E3VAA 2340-BGA
AGIB027R31B2E3E 3184-BGA
AGFB023R25A2E4F 2581-FBGA
AGFD019R25A3E3E 2581-FBGA
AGFD019R25A3E4X 2581-FBGA
CY8C4125LQQ-S432 32-QFN
CY8C4145AXQ-S433 44-TQFP
CY8C4126AXQ-S433 44-TQFP
CY8C4146LQQ-S422 32-UFQFN
CY8C4146LQQ-S432 32-UFQFN
CY8C4146AXQ-S423 44-TQFP
CY8C4146AXQ-S433 44-TQFP
CY8C4126LQE-S453 40-QFN
CY8C4146AZE-S275 64-TQFP
CY8C4146AZE-S455 64-TQFP
CY8C4126AZE-S455 64-TQFP
CY8C4146LQE-S273 40-UFQFN
CY8C4025AZQ-S403 48-TQFP
CY8C4146LQE-S453 40-UFQFN
CY8C4126LQA-S453 40-UFQFN
LS1020ASN7KQB 525-FCPBGA
LS1021AXN7HNB 525-FCPBGA
LS1021ASN7KQB 525-FCPBGA
T1024NXN7MQA FBGA-780
LS1026AXN8P1A 780-FCPBGA
LX2120XN72029B 1517-FCPBGA
Frequently Asked Questions
Are your products original?
Yes, all products are original. Sourcing new original imported components is our primary business focus.
Which Certificates do you have?
We are an ISO 9001:2015 Certified Company and an active member of ERAI.
Can you support small quantity orders or samples? Is the sample free?
Yes, we support sample orders and small quantity purchases. Sample costs vary depending on your specific order requirements and project scope.
How do you ship orders? Is it safe?
We use major express carriers including DHL, FedEx, UPS, TNT, and EMS. We can also accommodate your preferred shipping forwarder. All products are securely packaged to ensure safety during transit, and we assume responsibility for any product damage to your order.
What is the typical lead time?
We can ship in-stock components within 5 working days. For items not currently in stock, we will confirm the lead time based on your order quantity.

Tag:

AI Processor Chip WP34C2R4NFEI-400B2,

WP34C2R4NFEI-400B2,

4 nm Process AI Processor Chip

Contact Details
ShenZhen Mingjiada Electronics Co.,Ltd.

Contact Person: Sales Manager

Tel: 86-13410018555

Fax: 86-0755-83957753

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