400 Gb/s HSIO High Speed Pluggable I/O Connector with 60 Position and 0.75 mm Pitch for Ultra-High-Bandwidth Transmission

2291931-1 is a CDFP Style 1 integrated cage-type HSIO high-speed pluggable I/O connector that complies with the 400G high-speed signal interconnect standard. This connector features a metal shielded cage and a 60-pin female connector molded as a single unit, utilizing a 0.75 mm precision center-to-center pitch and a solderless crimp-through-hole PCB termination solution.

Designed for ultra-high-bandwidth transmission applications including data centers, high-end switches, AI servers, and other demanding scenarios. It supports hot-swappable interconnection with CDFP active optical cables (AOCs) and high-speed copper modules, serving as a single-port, 400 Gbps-class, high-density, high-speed I/O core interconnect component.

• Ultra-high-bandwidth transmission: Maximum total transmission rate of 400 Gbps, compatible with 400G Ethernet and InfiniBand high-speed protocols
• Precision engineering: 0.75 mm terminal pitch strictly controls differential impedance, suppressing high-speed signal crosstalk and reflection loss
• Multi-channel architecture: Supports 8-channel parallel high-speed differential signal transmission with per-channel rate of 50 Gbps
• Terminal electrical specifications: High-elasticity phosphor bronze base material with 0.76 μm gold plating for oxidation resistance and stable conductivity
• Robust construction: Zinc alloy shielding cage with nickel-plated surface and integrated elastic rubber seal for complete EMI shielding and dust-tight sealing
• Simplified installation: Press-fit solderless process eliminates need for reflow soldering
• Environmental reliability: UL94 V-0 flame retardancy rating and operating temperature range from -40°C to +85°C
• Hot-swap compatibility: Works with standard CDFP optical transceiver modules and high-speed copper cable assemblies

• Core network equipment for cloud data centers
• 400G switches, core routers and TOR spine-and-leaf switches
• AI computing servers and supercomputing clusters
• GPU-accelerated servers and high-performance computing nodes
• High-speed storage arrays and distributed storage devices
• 5G/6G communication base station edge equipment
• Industrial high-speed measurement and control equipment
• Industrial machine vision and high-speed data acquisition instruments