EM9304V01LF28B Bluetooth IC Low-Power BT 5.0 Low Energy SOC in QFN-28 Package

The EM9304 is a tiny, low-power, integrated circuit (IC) optimized for Bluetooth® 5.0 low energy enabled products. The flexible architecture allows it to act as a companion IC to any ASIC or MCU-based product, or as a complete System-on-Chip (SoC). Custom applications can execute from one-time-programmable (OTP) memory, and digital peripherals (SPI or I2C) can interface with external devices such as sensors, memory, display, or touch drivers.

System-on-Chip:
• Energy efficient, industry standard, ARC EM4, 32-bit MCU running at 24MHz
• Floating-point unit for sensor processing
• 136kB ROM including link layer and stack
• 128kB OTP for parameters, profiles, and applications - 24MHz execution speed
• 48kB instruction RAM and 28kB data RAM
• 4, 8, or 20kB with selectable data retention
• Universal, sleep, and protocol timers
• I2C and SPI master interfaces
• Up to 12 GPIO
Bluetooth 5.0 Low Energy Technology:
• BT 5.0 Controller Subsystem (QD ID 93999)
• Bluetooth stack (QD ID 84268) in ROM
• SPI and UART HCI/ACI Transport Layers
• Up to eight simultaneous connections supported
• Extended PDU length and enhanced security
Security Features:
• True Random Number Generator
• AES-128 Hardware Encryption Engine
• Key Generation (ECC-P256)
• Firmware Over-the-Air Updating
Power Management System:
• Digital step-up/down DCDC operation
• Supports 1.5V and 3.0V batteries
• Scheduler and memory manager
• Low frequency RC or crystal oscillator time base
Current Consumption at 3V:
• 3.0mA typical peak receiver current
• 5.2mA typical peak transmitter current at 0.4dBm
• 1.0μA connected sleep mode
• 5nA chip disable mode
RF Performance:
• -94dBm Bluetooth low energy receiver sensitivity for 1Mpbs operation and 37 byte payload
• -34 to +6.1dBm transmitter output power range
Component Requirements:
• 3 DC caps, 1 DCDC coil, 1 ferrite bead
• Single ended 50Ω antenna pin (no balun)
• 48MHz XTAL, 32kHz XTAL (optional)
Packaging & Operating Range:
• QFN-28 (4x4mm), WLCSP25, and bare-die/wafer
• Industrial Operating Temperature Range: -40°C to +85°C
Customer Support:
• Hardware and software development kits
• FCC/CE certification support
• Forum for hardware and software support