H5AN8G6NDJR-XNC Memory IC Chip 8Gb DDR4 SDRAM with 3200 Mbps Data Rate in FBGA-96 Package

H5AN8G6NDJR-XNC is a 8Gb CMOS Double Data Rate IV (DDR4) Synchronous DRAM, ideally suited for main memory applications requiring large memory density and high bandwidth.

• VDD=VDDQ=1.2V +/- 0.06V
• Fully differential clock inputs (CK, CK) operation
• Differential Data Strobe (DQS, DQS)
• On chip DLL align DQ, DQS and DQS transition with CK transition
• DM masks write data-in at both rising and falling edges of data strobe
• Programmable CAS latency 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19 and 20 supported
• Programmable additive latency 0, CL-1, and CL-2 supported (x4/x8 only)
• Programmable CAS Write latency (CWL) = 9, 10, 11, 12, 14, 16, 18
• Programmable burst length 4/8 with both nibble sequential and interleave mode
• BL switch on the fly
• 16 banks
• Average Refresh Cycle (Tcase of 0°C~95°C)
• JEDEC standard 78ball FBGA(x4/x8), 78ball FBGA(x16)
• Driver strength selected by MRS
• Dynamic On Die Termination supported
• Two Termination States such as RTT_PARK and RTT_NOM switchable by ODT pin
• Asynchronous RESET pin supported
• ZQ calibration supported
• TDQS (Termination Data Strobe) supported (x8 only)
• Write Levelization supported
• 8 bit pre-fetch
• RoHS compliant
• Internal Vref DQ level generation available
• Write CRC supported at all speed grades
• Maximum Power Saving Mode supported
• TCAR (Temperature Controlled Auto Refresh) mode supported
• LP ASR (Low Power Auto Self Refresh) mode supported
• Fine Granularity Refresh supported
• Per DRAM Addressability supported
• Geardown Mode (1/2 rate, 1/4 rate) supported
• Programmable Preamble for read and write supported
• Self Refresh Abort supported
• CA parity (Command/Address Parity) mode supported
• Bank Grouping applied with CAS to CAS latency for same/different bank group accesses
• DBI (Data Bus Inversion) supported (x8)

Personal Computing Devices: Memory modules (SO-DIMM) for high-performance laptops and mini PCs (NUCs); On-board memory design for all-in-one PCs and entry-level desktops

Servers and Data Centers: Memory module assemblies (RDIMM/UDIMM) for enterprise-class servers; Edge nodes in data center storage arrays; Memory pools for cloud computing infrastructure

Industrial and Embedded Systems: System memory for industrial control and automation equipment; Packet buffering for network communication equipment (routers, switches); Main memory for medical devices and test and measurement instruments

Consumer Electronics: Devices requiring high memory bandwidth, such as high-end smart TVs, digital set-top boxes and games consoles