VD55H1CCA0/RW Sensor IC 3D iToF Sensor Die with 0.54 Mpixel Resolution Low-Noise and 80 mW Power Consumption

VD55H1 is a low-noise, low-power, 672 x 804 pixel (0.54 Mpix), indirect Time-of-Flight (iToF) sensor die manufactured on advanced backside-illuminated, stacked wafer technology. Combined with a 940 nm illumination system, this sensor enables building a small form-factor 3D camera producing a high-definition depth map with typical ranging distance up to 5 meters in full resolution, and beyond 5 meters with patterned illumination.

With a unique ability to operate at 200 MHz modulation frequency and more than 85% demodulation contrast, the VD55H1 can produce depth precision twice as good as typical 100 MHz modulated sensors, while multifrequency operation provides long distance ranging. The low-power 4.6 µm pixel enables state-of-the-art power consumption, with average sensor power down to 80 mW in some modes.