Mingjiada Electronics specializes in purchasing VisionICs' full range of 3D ToF image sensors at competitive prices. We focus on recycling models VI4310, VI4320, VI4330, and VI4331. Both factory-original and repackaged units are accepted, with no restrictions on quantity or batches. We provide customers with transparent quotations, efficient testing, and rapid settlement through our one-stop inventory recycling service, helping businesses revitalize idle electronic component assets.
VisionICs 3D ToF image sensors leverage proprietary single-photon detection and direct time-of-flight (dToF) core technologies. These highly integrated system-on-chip solutions deliver centimeter-accurate 3D point cloud data and depth maps without requiring external image signal processors. As core sensor components for automotive, robotics, industrial vision, AR/VR, and other fields, they offer high market value and strong liquidity, offering substantial potential for monetizing idle inventory.
Key features and application scenarios for the four models targeted in this acquisition are as follows:
VI4310: 19K-pixel (160×120) SPAD detector array with 15-meter range and ±1% accuracy. CoB-packaged for ADAS intelligent driving assistance, 3D mapping in robotic vacuums, and drone collision avoidance. A mainstream choice for low-pixel, lightweight 3D imaging.
VI4320: 16K-pixel (256×64) SPAD detector array supporting 4×2 pixel binning mode. Delivers equivalent 15-meter ranging performance in CoB packaging. Widely used in autonomous driving LiDAR, 3D machine vision, and gesture-controlled security surveillance.
VI4330: 76.8K-pixel (320×240) high-resolution SPAD detector array supporting 2×2/4×4 pixel binning. Equipped with dual MIPI-CSI2/DVP output interfaces, it delivers superior ranging accuracy and serves as a core sensor component for advanced driver assistance, high-end robotic mapping, and AR/VR applications.
VI4331: An upgraded version of VI4330, it retains high resolution and precise ranging capabilities while optimizing power consumption and environmental interference resistance. Tailored for demanding applications like automotive LiDAR and industrial high-end 3D vision inspection, it offers high market scarcity.
Mingjiada Electronics Acquisition Service Guarantees
Transparent Pricing: Our professional component evaluation team provides fair quotes based on market conditions and product status, with no hidden fees—our quoted price is the final transaction price.
Efficient Testing: Equipped with specialized testing equipment, we support on-site evaluations, field testing, or sample shipping for rapid determination of chip functionality and quality.
Swift Settlement: Immediate cash payment upon passing inspection, supporting multiple settlement methods including business-to-business transfers and cash, with no payment delays.
Flexible Service: Nationwide pickup service; remote areas supported via courier sample submission (shipping costs covered by us). Factory-original, unopened packages may be settled directly without testing.
Series Expansion: Simultaneously acquiring the full range of VisionICs brand 3D ToF image sensors and supporting components, providing one-stop solutions for all types of idle inventory needs.
Acquisition Scope: Beyond VisionICs, we concurrently acquire 3D ToF sensors including Infineon's REAL3™ series (IRS2877/IRS2975/IRS2976), Sony's IMX series, and ams OSRAM's Belago series, establishing a comprehensive 3D vision chip recycling platform.
Procurement Process
With years of experience in electronic component recycling and deep expertise in semiconductor sensor chips, we offer comprehensive recycling channels and competitive pricing. Businesses, electronics traders, and R&D institutions are welcome to contact us. Provide product model, quantity, and packaging status to receive a prompt and accurate quote.
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