Shenzhen Mingjiada Electronics Co., Ltd. supplies and recycles the Qorvo AWMF-0146 highly integrated silicon-based Ku-band quad-core receive beamformer.
I. AWMF-0146 Product Overview
The AWMF-0146 is a silicon-based quad-core 4×2 receive beamformer chip launched by Qorvo (formerly Anokiwave’s second-generation Ku-band SATCOM platform). It operates across the Ku-band receive frequency range of 10.7–12.75 GHz and is designed for flat-panel active phased array satellite communication terminals. Utilising advanced silicon processes, the device highly integrates RF paths, digitally controlled phase/gain adjustment, polarisation switching, and temperature monitoring and compensation circuits. A single chip drives four sets of dual-polarisation radiating elements, enabling a lightweight, scalable planar phased array receive front-end that supports automatic beam acquisition, tracking and alignment for Satcom-on-the-Move systems across LEO, MEO and GEO orbits.
Unlike traditional discrete MMIC solutions, the AWMF-0146 leverages the advantages of the 300 mm silicon-based process to reduce size, power consumption and mass production costs, whilst incorporating a wealth of digital auxiliary functions. This significantly simplifies the active antenna hardware architecture and calibration process, making it the core RF chip for a new generation of ultra-thin flat-panel satellite receiving phased arrays. For the corresponding transmit-side solution, the AWMF-0147 Ku-band transmit beamformer from the same series can be selected to form a complete Ku-band transmit-receive phased array solution.
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II. AWMF-0146 Core Architecture and Key Features
RF and Beam Control Capabilities
1. Quad-core 4×2-channel architecture
A single chip integrates four receive channels, with each channel supporting dual-polarisation input. It is compatible with right-hand circular polarisation (RHCP), left-hand circular polarisation (LHCP) and linear polarisation, allowing flexible switching to meet mainstream Ku-band satellite communication polarisation standards.
2. High-Precision Digital Beam Control
6-bit phase control enables fine-tuned beam pointing adjustment;
5-bit gain control achieves channel amplitude equalisation and sidelobe suppression;
Supports independent channel gain and phase configuration, facilitating array beamforming and interference suppression.
Built-in intelligent system functions
On-chip temperature gain compensation: automatically offsets RF gain drift in wide temperature ranges, reducing beam distortion caused by array temperature drift;
Built-in temperature sensor reporting: real-time output of chip temperature data, enabling the system to perform array thermal management and dynamic calibration;
Full-pin ESD protection, enhancing the reliability of the entire unit in vehicle-mounted and airborne mobile terminal environments.
Power Supply and Packaging Advantages
Single +1.2V low-voltage power supply significantly reduces the array’s overall power consumption and alleviates thermal management pressures for large-area phased arrays;
WLCSP (Wafer-Level Chip-Scale Packaging) offers a compact form factor, allowing direct embedding within the antenna radiation element grid to meet the layout constraints of ultra-thin flat-panel antennas, whilst simplifying PCB routing and thermal management design;
Suitable for tile-based phased array architectures, enabling seamless multi-chip tiling and flexible scaling of array size.
III. Key Advantages of the AWMF-0146 Silicon-Based Beamforming Solution
High integration, streamlined BOM
Integrates multiple LNAs, phase shifters, attenuators, polarisation switches and digital control interfaces onto a single chip, replacing over a dozen discrete RF components, reducing passive matching circuits and minimising the antenna front-end footprint.
Excellent SWaP-C Performance
Compact size, low power consumption and lightweight design meet the stringent space and power requirements of in-motion communication terminals for automotive, marine and airborne applications; silicon-based processes support high-volume mass production, effectively controlling terminal costs.
Simplified System Commissioning
Built-in temperature compensation and status monitoring reduce the need for external calibration circuits; standardised digital control interfaces facilitate rapid beam steering and continuous satellite tracking by the master FPGA.
Highly Scalable Array
With a minimum array unit size of 4 elements, multiple AWMF-0146 chips can be cascaded to build Ku-band receiving phased arrays ranging from small to large apertures, covering various scenarios including portable terminals, fixed ground stations and mobile platforms.
IV. Typical Application Scenarios for the AWMF-0146
Ku-band flat-panel phased array satellite reception terminals (LEO/MEO/GEO satellite communications)
Active reception antennas for satellite-to-moving-target (SOTM) communications on vehicles, vessels and aircraft
Portable satellite broadband reception ground stations
Low-profile tile-based active phased array reception systems
Commercial satellite communications and aerospace broadband access equipment
V. Summary of the AWMF-0146
With its silicon-based, highly integrated quad-core architecture, flexible dual-polarisation support, high-precision beam control and built-in temperature compensation, the AWMF-0146 has become the benchmark chip for Ku-band flat-panel phased array receive front-ends. Aimed at the rapidly expanding low-Earth orbit (LEO) satellite internet sector, this device enables equipment manufacturers to develop slim, low-cost, mass-deployable active satellite receiving antennas, thereby facilitating the commercialisation of global mobile broadband satellite communication terminals.
Contact Person: Mr. Sales Manager
Tel: 86-13410018555
Fax: 86-0755-83957753