Shenzhen Mingjiada Electronics Co., Ltd. supplies and recycles the Qorvo AWMF-0164 single-polarisation four-beam former, suitable for 5G phased array applications.
I. AWMF-0164 Product Overview
The AWMF-0164 is Qorvo’s second-generation, highly integrated, silicon-based, quad-core 4×1 single-polarisation millimetre-wave beamformer chip, designed for the 3GPP n258 millimetre-wave band and specifically developed for 5G millimetre-wave active phased array antennas. The single chip supports four transmit/receive radiating elements. Its half-duplex architecture enables a single antenna element to perform both transmission and reception simultaneously, significantly simplifying the RF front-end hardware design for phased arrays. It serves as the core RF component for commercial 5G millimetre-wave small cells and active antenna arrays. The chip utilises WLCSP (wafer-level chip-scale packaging) and supports flip-chip mounting, allowing it to be placed directly within the antenna element grid. This reduces the array’s volume and lowers the system’s SWaP-C (size, weight, power consumption and cost), making it suitable for large-scale array deployment and network expansion.
II. Key Electrical Parameters of the AWMF-0164
Operating frequency band: 24.25–27.5 GHz, covering the 5G n258 millimetre-wave band
Channel architecture: 4-channel single-polarisation, half-duplex Tx/Rx operating mode
Phase control: 6 phase shifts, LSB step of 6.5°, enabling high-precision beam steering adjustment
Gain control: 5-bit gain adjustment with 0.5 dB LSB steps, enabling channel amplitude equalisation calibration
Typical transmit gain: 25 dB, with a maximum adjustable output power of 15.5 dBm
Typical receive gain: 30 dB, with excellent receive noise performance
Supply voltage: Dual-supply operation at +1.8 V and +2.5 V
Control interface: SPI digital control, with built-in beam weight storage registers, supporting rapid beam switching
Protection features: ESD protection integrated on all pins; built-in temperature-dependent gain compensation, chip temperature reporting and transmit power telemetry functions, suitable for long-term continuous operation
Package type: WLCSP (Wafer-Level Chip-Scale Package), compatible with flip-chip bonding processes and planar phased array board designs
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III. Key Technical Features of the AWMF-0164
1. Highly Integrated Quad-Core Single-Polarisation Architecture
A single chip integrates a complete four-channel beam control chain, with phase shifting, gain adjustment and status telemetry all implemented on-chip. This reduces the number of external discrete RF components, minimises the bill of materials and simplifies PCB routing. It supports multi-chip cascading, enabling the flexible construction of 8-, 16- or 32-channel phased array systems and larger-scale arrays.
2. Temperature Adaptation and On-Chip Telemetry
Built-in temperature gain compensation suppresses RF gain drift in high and low temperature environments; real-time reporting of chip temperature and transmit channel power status facilitates closed-loop power control by the system, ensuring stable performance of the millimetre-wave array in complex environments and meeting the long-term operational reliability requirements of base station equipment.
3. High-Speed Beam Switching Capability
On-chip beam weight storage registers allow for the pre-storage of multiple beam configurations, with rapid beam switching achieved via SPI commands. This meets the service requirements for 5G millimetre-wave beam tracking and dynamic user handover, enhancing communication continuity in mobile scenarios.
4. Engineering-Friendly Packaging and Assembly
The WLCSP package supports flip-chip mounting, with extremely short RF traces that minimise high-frequency losses in the millimetre-wave band. It is ideally suited for compact active antenna panels, facilitating the mass production and deployment of 5G small cells and slimline phased array equipment.
IV. Typical Application Scenarios for the AWMF-0164
5G millimetre-wave phased array active antennas (n258 band), suitable for 5G phased array applications, 5G small cells and outdoor macro-station millimetre-wave arrays
Millimetre-wave communication test platforms and phased array development and validation kits
Short-range millimetre-wave point-to-point communication equipment
Can be paired with the AWMF‑0188 intermediate frequency up/down converter chip to build a complete RF phased array system solution
Contact Person: Mr. Sales Manager
Tel: 86-13410018555
Fax: 86-0755-83957753