Mingjiada Electronics Supply & Purchase: Qualcomm SM-8550-0-MPSP1581-MT-02-0-AC/SM-8550-0-MPSP1581-MT-01-0-AB Snapdragon 8 Gen 2 AI Processor
Product Overview
Both SM-8550-0-MPSP1581-MT-02-0-AC and SM-8550-0-MPSP1581-MT-01-0-AB are Qualcomm Snapdragon 8 Gen 2 (SM8550) series mobile AI processors manufactured using TSMC's 4nm process. Featuring an “1+2+2+3” octa-core architecture (1×Cortex‑X3 super-core + 2×Cortex‑A715 performance cores + 2×Cortex‑A710 performance cores + 3×Cortex‑A510 efficiency cores), it integrates an Adreno 740 GPU and Hexagon 790 NPU, Supports LPDDR5X memory and UFS 4.0 storage, integrates the Snapdragon X70 5G modem, delivering robust general-purpose computing, graphics processing, and AI computing power. It meets the complex computational and low-power demands of high-end mobile devices and edge AI scenarios, serving as the core processor solution for flagship mobile and edge computing.
Key Features
Superior AI and Computing Performance: The Hexagon 790 NPU supports INT4 precision, delivering significantly enhanced AI performance over previous generations to empower applications like intelligent imaging, voice assistants, and gaming AI. The Adreno 740 GPU offers robust performance with ray tracing and hardware acceleration support, enabling high-definition gaming and complex graphics rendering.
High-Speed Storage and Connectivity: Supports quad-channel LPDDR5X 4200MHz memory (67.2GB/s bandwidth) and UFS 4.0 storage, paired with USB 3.1 and PCIe 4.0 high-speed interfaces to ensure rapid data transfer and system responsiveness. Integrated Snapdragon X70 5G modem supports both mmWave and Sub-6GHz 5G networks, delivering peak download speeds of 10Gbps. It also supports Wi-Fi 7 and Bluetooth 5.3 for fast, stable wireless connectivity.
Professional Imaging and Display: Features the Spectra 390 ISP supporting up to 32MP dual-camera simultaneous capture, 8K30fps video recording, and multi-format video encoding/decoding. Enables 4K@60Hz display output and QHD+@144Hz high refresh rates, compatible with HDR10+, HDR Vivid, and other HDR standards for premium visual experiences.
Low Power Consumption and Multi-Scenario Adaptability: TSMC's 4nm process combined with a multi-core energy-efficient architecture achieves a TDP of approximately 8.5W, balancing performance and power consumption. It adapts to diverse power consumption scenarios such as mobile terminals, smart cockpits, and edge computing.
Key Specifications
Product Model: SM-8550-0-MPSP1581-MT-02-0-AC, SM-8550-0-MPSP1581-MT-01-0-AB (both Snapdragon 8 Gen 2 SM8550)
Manufacturing Process: TSMC 4nm (N4P)
CPU Architecture: 1×Cortex‑X3 (3.2GHz) + 2×Cortex‑A715 (2.8GHz) + 2×Cortex‑A710 (2.8GHz) + 3×Cortex‑A510 (2.0GHz)
GPU: Adreno 740
NPU: Hexagon 790 (supports INT4 precision)
Memory Support: Quad-channel LPDDR5X 4200MHz (67.2GB/s bandwidth)
Storage Support: UFS 4.0
Modem: Snapdragon X70 5G (supports mmWave / Sub-6GHz, peak download 10Gbps)
Wireless Connectivity: Wi-Fi 7, Bluetooth 5.3
ISP: Spectra 390 (supports 8K30fps video recording)
Display Output: 4K@60Hz, QHD+@144Hz
Typical Power Consumption: Approx. 8.5W (TDP)
Typical Applications: High-end smartphones, smart cockpits, edge AI computing, VR/AR devices, industrial handheld terminals
Professional High-Value Recycling: Mingjiada offers premium recycling for both chips, accepting factory surplus, project remnants, and idle inventory. The recycling process typically includes: submitting a list, receiving a quote within 24 hours, signing a contract, and payment upon inspection.
Contact Information
For pricing inquiries or recycling consultations, contact Mingjiada Electronics (Contact: Mr. Chen) via:
Phone: +86 13410018555
Email: sales@hkmjd.com
Address: 1239-1241, Xin Asia Guoli Building, Zhenzhong Road, Futian District, Shenzhen
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